JPH01113352U - - Google Patents

Info

Publication number
JPH01113352U
JPH01113352U JP801988U JP801988U JPH01113352U JP H01113352 U JPH01113352 U JP H01113352U JP 801988 U JP801988 U JP 801988U JP 801988 U JP801988 U JP 801988U JP H01113352 U JPH01113352 U JP H01113352U
Authority
JP
Japan
Prior art keywords
semiconductor element
heat dissipation
dissipation plate
block
claw
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP801988U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP801988U priority Critical patent/JPH01113352U/ja
Publication of JPH01113352U publication Critical patent/JPH01113352U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Adhesives Or Adhesive Processes (AREA)
JP801988U 1988-01-25 1988-01-25 Pending JPH01113352U (en])

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP801988U JPH01113352U (en]) 1988-01-25 1988-01-25

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP801988U JPH01113352U (en]) 1988-01-25 1988-01-25

Publications (1)

Publication Number Publication Date
JPH01113352U true JPH01113352U (en]) 1989-07-31

Family

ID=31213525

Family Applications (1)

Application Number Title Priority Date Filing Date
JP801988U Pending JPH01113352U (en]) 1988-01-25 1988-01-25

Country Status (1)

Country Link
JP (1) JPH01113352U (en])

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